Main Application：

Widely used for single-side lapping and polishing of metal and non-metal materials, including LED sapphire substrates, optical glass wafers, quartz wafers, silicon wafers, stainless steel, aluminum alloys, titanium alloys, bearing steel, sealing rings, and various ceramics. Equipment Principle： This is a precision lapping and polishing equipment. The material to be lapped and polished is placed on the lapping plate. The lapping plate rotates counterclockwise, and the workpiece ring drives the workpiece to rotate on its own. Pressure is applied to the workpiece by means of gravity, and the relative movement and friction between the workpiece and the lapping plate achieve the purpose of lapping and polishing. Equipment Functions： An intermittent automatic liquid spraying device is adopted, and the liquid spraying interval can be set freely. Its working principle is: when the stirring function is activated, the grinding fluid will automatically flow onto the lapping plate through the dropper, and the flow rate can be adjusted according to requirements (see the dropper pump manual for specific adjustment methods). The flatness of the lapping plate is ≤ 0.001mm. This equipment adopts the weight block pressurization method for workpiece pressurization, and the pressure is adjustable. This equipment uses a switch button control system. The rotation speed and timing of the lapping plate can be directly set on the control panel, enabling convenient operation. This equipment is equipped with an automatic plate dressing device, which can dress the flatness of the lapping plate at any time as needed to ensure the lapping precision of products.

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