How to Achieve Precise and Efficient Wafer Thinning on Backside Wafer Thinning Machine English

2026-02-03 · News

The core criteria for precise and efficient wafer thinning on a Backside Wafer Thinning Machine are thickness control accuracy of ±1–2 μm, TTV (Total Thickness Variation) ≤ 2 μm, and zero defects such as edge chipping, microcracks, and surface scratches.

Core Advantages of the Dual-Axis Wafer Grinder and Why It Has Become the Mainstream Choice for Precision Machining

2026-01-29 · News

The Dual-Axis Wafer Grinder is the core equipment for precision wafer thinning. It realizes the integrated processing of rough grinding and fine grinding through the coordinated operation of dual spindles, satisfying the ultra-thinning and high-precision

Differences Between Semi-Automatic and Fully Automatic Wafer Grinders

2026-01-22 · News

Wafer grinders are primarily categorized by their level of automation into Semi-Automatic Wafer Grinders and Fully Automatic Wafer Grinders. While the core function of both is the precise reduction of wafer thickness, they differ significantly in automati

Is the Fully Automatic Wafer Grinder compatible with all wafer sizes?

2026-01-20 · News

The Fully Automatic Wafer Grinder is compatible with conventional 4-inch, 6-inch, 8-inch, and 12-inch wafers, but not all sizes. Its adaptability is limited by multiple factors such as equipment structure, fixture specifications, and control systems, and

Are Wafer Edge Grinders and Metal Chamfering Machines the Same Equipment? What are the Differences?

2026-01-15 · News

Wafer Edge Grinders and metal chamfering machines are not the same type of equipment. Although both feature "chamfering" as a core function, the former is a high-precision specialized device for the semiconductor field, while the latter is a gen

How to Achieve a Perfect Mirror Finish on a Mirror Polishing Machine

2026-01-13 · News

The core criteria for a perfect mirror finish are a surface roughness of Ra≤0.002μm, with no scratches, material lines, or other defects. Its realization relies on a systematic solution of material adaptation, process control, and equipment coordination.A

Mirror Polishing Machine: Application Scenarios and Technical Implementation

2026-01-08 · News

Mirror polishing machines achieve a mirror finish with a surface roughness of Ra≤0.001μm through the synergistic effect of physical grinding and chemical polishing.In terms of processable materials and technical implementation, the equipment is suitable f

Lapping Machine After-Sales Service and Operation & Maintenance Specifications

2026-01-06 · News

The quality of after-sales service for lapping machine is directly related to the stability of the equipment's processing accuracy and the efficiency throughout its entire service life. For the full-cycle service after equipment sales, it is necessary

The Application Value and Application Fields of Laboratory-Scale Flat Lapping Machine

2026-01-01 · News

Laboratory-Scale Flat Lapping Machinehas become one of the most popular pieces of equipment in precision laboratories of numerous domestic universities, research institutes and enterprises in recent years. Owing to its compact size and high precision, it

Precision Lapping and Polishing Industry: Copper Polishing Technology Emerges as the Core Pillar of High-end Manufacturing, Propelled by Dual Drivers of Technological Upgrading and Demand Expansion

2025-12-30 · News

Along with the rapid iteration of high-end manufacturing sectors including semiconductors, optoelectronic information and new energy, copper polishing technology, with copper lapping plates as its core, has become a pivotal niche segment in the precision lapping and polishing industry by virtue of its high-precision pr……

Full-Cycle After-Sales Service System and Operation & Maintenance Specifications for Wafer Grinding Machine

2025-12-25 · News

After eachWafer Grinding Machinerolls off the production line, we provide a comprehensive after-sales service to ensure the customer’s normal operation.During the commissioning and training of theWafer Grinding Machine, the training content is delivered i

Ceramic CMP Polishing Technology: Evolution and Landscape of Precision Machining

2025-12-23 · News

Against the backdrop of high-end manufacturing upgrading toward "ultimate precision", theceramic chemical mechanical polishing (CMP)industry is in a critical phase of "precision breakthrough, scenario expansion, and technological restructur