Wafer Edge Grinder  relies on high-precision positioning and micro-cutting mechanism to complete edge chamfering, deburring and arc forming of workpieces in one pass. The chamfer angle and dimension can be set digitally, with stable and controllable machining accuracy. Adopting clamping-feed linkage structure, the machine automatically aligns workpieces after clamping. Spindle speed and cutting stroke are adjustable. It is suitable for hard and brittle wafer materials including silicon wafers, lithium tantalate, lithium niobate, silicon carbide, sapphire and indium phosphide. Uniform cutting depth prevents chipping, dimensional deviation and surface scratches caused by manual grinding. The formed profile is regular, meeting pre-processing requirements for lapping, coating and assembly. Semi-automatic and fully-automatic modes are available for sample development and continuous mass production. The digital control system effectively eliminates dimensional fluctuations from manual operation, ensures batch processing consistency and reduces workpiece scrap rate. Precision edge chamfering relieves stress concentration at sharp corners and improves the stability of finished components. It serves as key pre-processing equipment for precision component machining.