Relying on the excellent plasticity and abrasive embedding capacity of copper plates, the Copper Plate Polishing Machine features unique process adaptability in ultra-precision flat machining. Different from ordinary hard lapping plate equipment, it can realize low-damage and highly uniform surface finishing. Equipped with a high-rigidity frame and servo closed-loop pressure regulating system, the machine supports segmented programming of pressure, rotating speed and processing duration. It adapts to the characteristics of copper materials: softness, easy deformation and oxidation. The low-pressure mode effectively avoids over-polishing, edge collapse and dimensional out-of-tolerance.

Copper plates have favorable shape retention and are easy to dress. They are not prone to local depression after long-term operation, so the flatness of workpieces can be stably maintained. Together with a circulating cooling slurry supply system, grinding heat and micro debris are continuously removed to prevent surface oxidation, blackening and haze defects, ensuring consistent roughness and mirror finish. Workpieces generate composite motion trajectories with planetary carriers, delivering uniform and controllable lapping patterns and reducing directional scratches to meet ultra-precision surface quality requirements.

The machine is compatible with a wide range of workpieces, widely used for finishing semiconductor substrates, conductive copper electronic parts, heat dissipation components and optical shims. It supports both small-batch sample R&D and mass production line integration. The built-in process recipes enable fast switching between rough lapping and fine polishing with simple commissioning, balancing processing efficiency and yield. It serves as core equipment for ultra-flat machining of copper parts and various thin sheets in precision manufacturing.