The Dual-Axis Wafer Grinder is equipped with two independent grinding spindles fitted with a coarse grinding wheel and a fine grinding wheel respectively. With one-time wafer clamping, it continuously completes coarse back-grinding and fine back-grinding processes, eliminating positioning errors caused by repeated loading and unloading. The dual-spindle servo system allows independent setting of rotating speed and feed rate. Coarse grinding removes material allowance rapidly, while fine grinding restrains the formation of the surface damage layer. The machine is equipped with an on-line closed-loop thickness detection unit, which monitors the remaining wafer thickness in real time and automatically adjusts grinding feed to stably control key geometric tolerances such as TTV and warpage. The high-rigidity frame reduces grinding vibration, lowers processing stress of wafers and minimizes chipping risk. It is suitable for back-grinding of 6–12 inch monocrystalline silicon and silicon carbide wafers, supporting both R&D sample trial production and mass manufacturing. Process parameter recipes can be saved and reused to ensure batch consistency. The processed wafers can be directly transferred to subsequent semiconductor processes including polishing and metallization.