Vacuum coating forms functional thin films through the deposition of coating particles on the substrate surface. The thickness uniformity and adhesion of the film layer directly determine the optical, electrical and protective properties of precision components. Conventional coating equipment features extensive and imprecise parameter regulation, easily causing uneven film thickness, pinholes and weak adhesion. It results in poor batch consistency and fails to meet the requirements of high-end precision manufacturing.
The
Wafer Coatering Machine is equipped with a vacuum closed-loop measurement and control system and a real-time power adjustment system, which continuously monitor and automatically correct the air pressure, temperature and process gas flow inside the chamber. Adopting a planetary revolution structure for workpiece operation, the equipment ensures uniform movement trajectories of substrates and stable deposition rate of coating particles. Integrated with an on-line film thickness monitoring unit, it supports preset target film thickness and dynamically adjusts process parameters during deposition to control film thickness deviation.
The equipment is compatible with multiple coating processes including evaporation and sputtering, capable of preparing metal films, dielectric films and hard protective films. The optimized chamber sealing performance reduces internal impurities and minimizes film defects. Process parameters can be saved and reused to realize direct process reproduction in different batches, stably producing film layers with small tolerances and excellent adhesion. Widely applied in the surface modification of optical lenses, semiconductor substrates and precision hardware parts, it improves the wear resistance, corrosion resistance and optical transmittance of workpieces and satisfies the mass production and processing requirements of precision components.
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