Lithium Tantalate Double-Side Lapping Machine adopts double-plate counter-lapping structure. It completes synchronous lapping on both sides of the wafer in one clamping, and the material removal amount on both sides maintains dynamic balance. Equipped with low-stress pressure control system and high-precision planetary transmission, the machine features stable plate rotation and uniform lapping trajectory across the whole area. Aiming at the hard and brittle property of lithium tantalate single crystal, the process precisely controls stress input to effectively suppress microcracks and lattice damage, fully preserving the intrinsic piezoelectric and optical properties of the material. The machine can stably control wafer thickness tolerance, parallelism and flatness with high precision, completely avoiding positioning deviation, wafer warpage and other defects caused by the traditional multi-turnover lapping process. It realizes integrated precision lapping of lithium tantalate wafers with double-side synchronization, low damage and high accuracy.