Small Flat Polishing Machine relies on precision transmission and flexible pressure regulating structure. With micro material removal and low-stress machining as its core mechanism, it is suitable for ultra-precision planar finishing of various small-size and thin precision specimens. It effectively solves substrate damage problems of specimens caused by large cutting depth and high machining stress of large polishing equipment. Equipped with an independent closed-loop control system, the machine can precisely match polishing speed, machining pressure and processing duration to realize controllable micron-level material removal. The homogenized plate motion trajectory eliminates machining defects such as local over-polishing and planar ripples, stably improving workpiece flatness accuracy and surface roughness grade. It preserves the original metallographic structure and physical properties of materials to the maximum extent and avoids secondary damages including microcracks and surface metamorphism induced during processing. The machine adapts to specimens of various materials such as metals, cemented carbides, ceramics, optical crystals and semiconductor substrates with strong universality. Adopting compact modular design, process parameters can be accurately stored and rapidly reproduced. Specimen assembly/disassembly and consumable replacement are convenient and efficient, enabling quick completion of multiple groups of process comparison tests. With the processing advantages of low damage, high flexibility and high precision, the equipment is widely used for metallographic sample preparation, micro-morphology inspection and specimen preparation for mechanical property testing in material laboratories. It also meets the small-batch precision machining requirements of miniature precision parts, providing standardized process support for material scientific research analysis and pre-processing for mass production of precision components.