The "mirror finish" produced by a mirror polishing machine is judged by data rather than by the eye

2025-09-22 · News

if evaluating the quality of a mirror polishing machine from a professional perspective, pay close attention to the above parameters: behind the stunning luster lies the machine’s pursuit of nanoscale precision, and more importantly, the industrial rigor of "data having the final say." After all, what a mirror polishin……

What are the three key factors affecting the precision of a surface grinder?

2025-09-19 · News

when producing high-precision products with a surface grinder, the coordinated operation of these three factors is essential to achieve "both flat and precise grinding".

What is the significant role of wafer thinning machines in the semiconductor chip field?

2025-09-17 · News

In summary, after processing chip substrates with wafer thinning machines, ultra-thin chips can be produced. This effectively enhances the storage and computing performance of various wearable devices and provides effective performance support in various intelligent and information-based fields.

What is the Chemical Mechanical Polishing (CMP) Process?

2025-09-15 · News

Therefore, Chemical Mechanical Polishing (CMP) is a global planarization process that combines chemical etching and mechanical polishing. It is a key process in ULSI (Ultra-Large-Scale Integration) production, with the machine containing 5 major systems and capable of polishing metal, dielectric, and semiconductor mate……

What are the main components of CMP slurry?

2025-09-10 · News

CMP slurry is a mixture of various chemical substances, which mainly includes abrasives, buffers, polishing agents, and additives. Among them, abrasives mainly play a role in removing oxides and metal residues on the silicon wafer surface; buffers mainly function to adjust the pH value and maintain the stability of the……

How Many Bonding Technologies Are Used for Ultra-Thin Wafers Before Thinning?

2025-09-08 · News

Generally, bonding methods include permanent bonding and temporary bonding/debonding; permanent bonding is further divided into direct bonding without an intermediate layer and indirect bonding with an intermediate layer. These are the main wafer bonding methods in the semiconductor industry. The appropriate bonding me……

What Impact Does the TSV Process Have on Wafer Polishing?

2025-09-04 · News

To achieve proper CMP polishing of copper plates in TSV structures, the equipment must be equipped with EPD Endpoint Detection and a Zoned Airbag Head.

How to Deal with Difficult-to-Clean Residual Particles on Wafer Surface After Polishing?

2025-09-01 · News

After wafer polishing, residual particles from polishing slurry abrasives and friction-generated embedded solids (which cause contamination and scratches) are typically cleaned using a PVA-material brush cleaner post-CMP, with regular polishing pad replacement also recommended to reduce contamination.

7.1 Army Day, always follow the Party!

2024-04-16 · News

The century long struggle is full of ups and downs Magnificent mountains and rivers forge ahead Celebrate the 100th anniversary of the founding of the CPC From 1921 to 2021 A hundred years of splendid history gracefully turned over The future of glory is eagerly awaited

What is the lining function in ceramic grinding machines?

2024-02-24 · News

Why do we need to add lining inside ceramic grinding machines? Because some ceramic grinding machines may experience temperature rise or pollution of the raw materials during long-term operation, resulting in high decibel noise and other issues! So

Problems and Solutions in Ge Wafer Grinding

1899-12-10 · News

During the grinding process of Ge wafers, due to the physical and chemical properties of the material itself (such as low hardness, high brittleness, easy oxidation, temperature sensitivity, etc.), problems such as surface damage, dimensional accuracy dev