Functional ceramic substrates feature high hardness and great brittleness, serving as core base materials for semiconductor packaging and optoelectronic devices. Traditional single-side lapping requires repeated flipping operations, resulting in low efficiency and large positioning errors. It also causes uneven stress distribution on substrates, leading to warpage, thickness deviation, microcracks and other defects, which fail to meet the mass production requirements for ultra-thin ceramic substrates with high precision.
The
Ceramic Double-Side Lapping Machine adopts a dual-plate synchronous counter-lapping structure. It completes synchronous double-sided grinding in a single clamping setup, eliminating repeated flipping and secondary calibration procedures. The equipment enables precise adjustment of lapping pressure, rotational speed and feed rate to ensure uniform material removal on both sides. It effectively counteracts processing stress, fundamentally improves substrate warpage and deformation, and strictly controls the thickness tolerance and parallelism of individual workpieces and entire batches.
Compatible with various hard and brittle ceramic materials such as alumina, aluminum nitride and silicon carbide, the machine adopts matched abrasives and refined processes to greatly reduce edge chipping, fragmentation and subsurface damage. The processed substrates feature flat surfaces and stable precision without secondary correction, and can be directly applied to subsequent procedures including polishing, coating and packaging. Suitable for both sample R&D and mass production, the equipment effectively breaks through the processing bottlenecks of high-precision thinning for ceramic substrates.
English
русский
한국어
Deutsch
español
italiano
العَرَبِيَّة