Lithium tantalate wafers are core piezoelectric crystal materials for manufacturing surface acoustic wave filters and optical modulators. Featuring high hardness, extreme brittleness and a special crystal structure, the material requires extremely stringent standards for processing uniformity and stress control. Traditional processing equipment mostly adopts segmented single-side lapping technology, which involves cumbersome procedures and low processing efficiency. Manual flipping and calibration also cause precision errors, resulting in inconsistent wafer thickness across batches and low product yield, failing to meet enterprises’ demands for large-batch and high-precision production. The
Lithium Tantalate (LiTaO₃) Double-Side Lapping Machine has become the core equipment for precision mass finishing of crystal wafers.
Innovating the traditional single-side processing mode, the machine adopts an integrated synchronous double-side lapping process, which completes precision flattening and margin removal on both the front and back sides of wafers in a single pass. It eliminates cumbersome procedures such as manual flipping and secondary clamping calibration, greatly streamlining the processing workflow and improving overall production efficiency. Equipped with a precision planetary transmission structure, the machine ensures uniform operation trajectories and balanced bilateral stress on workpieces during lapping, thoroughly avoiding common mass production defects including stress accumulation, wafer warpage and unilateral wear caused by single-side processing.
Featuring an intelligent CNC control system, the machine can accurately set core parameters such as lapping pressure, rotational speed and processing duration according to the material characteristics of lithium tantalate crystals. It supports parameter storage and reproduction, ensuring highly unified processing standards for all wafer batches. The high-rigidity body with a shock-absorbing structure eliminates edge chipping and micro-cracks caused by equipment vibration. It efficiently removes surface cutting damage layers of wafers while maximally preserving the original piezoelectric and optical properties of the crystals.
Compared with traditional processing equipment, this machine integrates multiple advantages including high processing precision, excellent mass production stability and high procedural efficiency. Processed lithium tantalate wafers feature uniform thickness, superior flatness and zero residual stress, perfectly adapting to subsequent precision manufacturing processes. Compatible with sample R&D and mass production of multi-size wafers, it steadily helps enterprises in optoelectronic communication and precision electronics industries achieve efficient, standardized and high-precision mass production.
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