Wafer Backside Grinder/wafer thinning machine

This is a High-efficiency grinder/polisher for wafers. What can the High Precision Backside Wafer Thinning Machine do？It can grind third generation semiconductor materials such as SiC, GaN,GaAs,.Si,Z……

Semi-Automatic Wafer Grinder,Experimental Wafer Grinder,Small Wafer Grinder

Semi-Automatic Wafer GrinderApplies to: wafer grinding or back-thinning of advanced materials, such as:SiC,GaAs,Sapphire,Si,GaN,InP.• Ultra-precision optical components, such as：ULE glass,High-energy ……

Automatic Wafer Grinder,Wafer Thinning Grinding Machine

Automatic wafer GrinderMain purpose:This equipment is mainly used for grinding Si Ge、GaAs、InP、SiC、GaN、ZnO、LiTaO3、 Semiconductor materials such as quartz glass and diamond.

Dual Spindle Wafer Grinder

Features:The outline and load-bearing structure adopt our latest cast iron frame, marble platform and support structure, and the support of the grinding wheel spindle is made of sand casting. Compared……