Localization Leap of Core EquipmentAs core equipment for manufacturing key components such as sapphire substrates, the technical level of sapphire double-sided lapping machines directly determines the development height of downstream high-end manufacturing industries. From relying on imports to independent innovation, domestic equipment enterprises have achieved a leap from "following" to "running side by side", and are expected to move towards "leading" in the future.

Three Development Stages: From Imitation to Independent BreakthroughThe development of domestic sapphire double-sided lapping machines is synchronized with the upgrading of industrial demand, going through three stages.

Before 2010: Technology Introduction and Imitation Stage. Domestic production was dominated by low-end processing, and the market was led by foreign brands such as Germany's Peter Wolters and Japan's SpeedFam. Domestic enterprises relied on imported core components, and the processing yield was less than 80%.

2010-2020: Independent R&D Stage. The LED industry stimulated demand. Some enterprises realized the localization of core components. The equipment flatness reached ±1μm, the surface roughness Ra ≤ 0.02μm, and the yield increased to 95%. However, the processing of large-size substrates still relied on imports.

Since 2020: High-end Breakthrough Stage. The third-generation semiconductors promoted equipment upgrading. Domestic enterprises achieved technological breakthroughs through industry-university-research innovation: the equipment precision reached the international advanced level, achieving ±0.1μm thickness tolerance and Ra ≤ 1nm roughness. The processing of 6-8 inch substrates was localized, and the market penetration rate rose from 35.4% in 2022 to 56% in 2025.

Domestic and Foreign Technologies: Coexistence of Gaps and AdvantagesDomestic enterprises have become important competitors, but there are still technical gaps. In terms of core indicators: the international surface roughness Ra ≤ 0.5nm, and the flatness of 8-inch substrates is ±0.05μm; domestic indicators are Ra ≤ 1nm and ±0.1μm respectively. The international processing efficiency of 6-inch substrates is 50 pieces per hour, while domestic is 40 pieces per hour. The annual failure rate of international equipment is ≤ 0.5%, and domestic is ≤ 1%.Advantages of international brands: