How Semiconductor Materials and Optical Glass Improve Surface Effects Through CMP Polishing Machine

2025-10-22 · News

In high-end manufacturing fields such as semiconductor materials, optical glass, and precision ceramics, the flatness and finish of workpiece surfaces directly determine product performance. As equipment dedicated to high-precision processing, theCMP Poli

High-Precision Grinding Machine: Working Principle and Key Performance Indicators

2025-10-20 · News

Working Principle ofhigh-precision grinding machineAhigh-precision grinding machineis a device that utilizes relative motion between abrasives and the workpiece surface, with its operation based on the principle of physical grinding. When the equipment st

How Does a Wafer Grinder Achieve Ultra-Thin Grinding of Semiconductor Materials?

2025-10-17 · News

How Does aWafer GrinderAchieve Ultra-Thin Grinding of Semiconductor Materials?AWafer Grinderis a key piece of equipment in semiconductor manufacturing for wafer thinning and surface flattening. Through the coordinated operation of precision mechanical mov

Grinding and Polishing Machine: Technical Principles and Core Applications

2025-10-15 · News

Grinding and Polishing Machineeliminates surface defects such as scratches and burrs through the relative motion between grinding media and workpieces, achieving a flat, smooth, or even mirror-like finish. Widely used in the optics, aviation, automotive,

Features, Advantages and Industrial Applications of High-Precision Wafer Edge Chamfering Machine

2025-10-13 · News

In fields such as semiconductors and optics that require extremely high processing precision, theGrindingprocess of hard and brittle materials is a key link determining product performance. After precision chamfering, various wafers can have improved stre

Analysis of Technical Principles and Core Applications of Double-Sided Lapping Machine

2025-10-10 · News

Adouble-sided lapping machineis equipment that performs simultaneous precision processing on both sides of a workpiece placed in the middle through the synchronous movement of two upper and lower lapping plates. Its core value lies in achieving high paral

Do Polishing Tools for Mirror Polishers Need Regular Replacement? How to Judge the Replacement Timing

2025-09-26 · News

The polishing tools (such as polishing wheels and polishing pads) of mirror polishers are the "direct executors" for achieving mirror-like effects. Their wear level directly affects the processing quality of mirror polishers, so regular replacem

The "mirror finish" produced by a mirror polishing machine is judged by data rather than by the eye

2025-09-22 · News

if evaluating the quality of a mirror polishing machine from a professional perspective, pay close attention to the above parameters: behind the stunning luster lies the machine’s pursuit of nanoscale precision, and more importantly, the industrial rigor of "data having the final say." After all, what a mirror polishin……

What are the three key factors affecting the precision of a surface grinder?

2025-09-19 · News

when producing high-precision products with a surface grinder, the coordinated operation of these three factors is essential to achieve "both flat and precise grinding".

What is the significant role of wafer thinning machines in the semiconductor chip field?

2025-09-17 · News

In summary, after processing chip substrates with wafer thinning machines, ultra-thin chips can be produced. This effectively enhances the storage and computing performance of various wearable devices and provides effective performance support in various intelligent and information-based fields.

What is the Chemical Mechanical Polishing (CMP) Process?

2025-09-15 · News

Therefore, Chemical Mechanical Polishing (CMP) is a global planarization process that combines chemical etching and mechanical polishing. It is a key process in ULSI (Ultra-Large-Scale Integration) production, with the machine containing 5 major systems and capable of polishing metal, dielectric, and semiconductor mate……

What are the main components of CMP slurry?

2025-09-10 · News

CMP slurry is a mixture of various chemical substances, which mainly includes abrasives, buffers, polishing agents, and additives. Among them, abrasives mainly play a role in removing oxides and metal residues on the silicon wafer surface; buffers mainly function to adjust the pH value and maintain the stability of the……