Ultra-precision polishing is a fundamental core process for high-end precision manufacturing. Its surface flatness, micro roughness and machining damage directly determine the forming quality and service stability of precision components. As a mainstream high-end device in the field of ultra-precision polishing, CMP (Chemical Mechanical Planarization) equipment breaks the physical limits of traditional polishing processes by adopting a composite machining mechanism combining chemistry and mechanics, and serves as a key part of the high-precision machining system for precision manufacturing.

Conventional purely mechanical polishing removes materials through rigid friction, which leads to concentrated contact stress and poor controllability during operation. This process can hardly eliminate microscopic surface ripples and layered undulations, and tends to cause surface scratches, residual stress and microcracks. It only reaches micron-level machining accuracy, and suffers from inherent drawbacks including low accuracy ceiling, poor consistency and high damage rate, failing to meet the nano-scale and damage-free machining standards of modern ultra-precision manufacturing.

CMP polishing equipment adopts an innovative polishing principle, realizing precision machining through the bidirectional coupling of chemical modification and micro mechanical material removal. Equipped with a high-precision closed-loop control system, it accurately regulates key process parameters such as polishing pressure, platen rotation speed and slurry feed rate. The active ingredients in polishing slurry mildly oxidize and complex the workpiece surface to form a soft and easily stripped surface layer. Afterwards, the polishing pad performs uniform micro-grinding to achieve controllable micro material removal.

This machining method fundamentally avoids damages caused by rigid mechanical impact. It enables full-area uniform polishing and stably delivers nano-level flatness and ultra-smooth surface. Meanwhile, machining consistency and product yield are greatly improved.