As the core equipment for processing precision products such as electronic ceramics and high-end structural ceramics, the processing accuracy of the
Ceramic Double-Sided Lapping Machine directly determines product performance. However, in the pursuit of higher precision and stability, the
Ceramic Double-Sided Lapping Machine still faces multiple key technical bottlenecks that restrict the realization of high-precision processing requirements.
The core technical bottlenecks are mainly reflected in three aspects:
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It is difficult to stably guarantee the abrasive grinding force. Large abrasive grains are prone to impact fragmentation, and small abrasive grains are easily blocked by chips, leading to fluctuations in grinding results;
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The problem of grinding deformation of thin workpieces is prominent. Fragile structures are prone to bending deformation during processing, affecting dimensional accuracy;
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There is a contradiction in grinding pressure control. Excessive pressure will increase motor load and cause vibration, while insufficient pressure will lead to insufficient output, making it difficult to balance efficiency and stability.
To address the above bottlenecks, targeted technical improvement schemes are required:
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In terms of optimizing abrasive grinding force, the grinding pressure, abrasive tool material hardness and workpiece characteristics should be collaboratively matched to avoid abrasive grain damage and give full play to the grinding effect;
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For workpiece deformation control, adopt the plane positioning design of the lower abrasive tool to avoid forced fixation. At the same time, through aging treatment after mechanical processing and cryogenic treatment after quenching, internal stress is completely eliminated to ensure the stability of workpiece structure;
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The precise control of grinding pressure relies on an adaptive PID algorithm, which dynamically adjusts the pressure according to the rough grinding and fine grinding stages and material characteristics to balance output, energy consumption and vibration.
To achieve the high-precision goals of 0.3μm flatness and 1μm TTV, it is also necessary to strengthen equipment and process upgrades. At the equipment level, high-precision aerostatic bearings are adopted to control the spindle runout within 0.3μm, ensuring the flatness and rotation accuracy of the grinding disc.
In terms of process parameters, set the upper and lower disc speed ratio ω1/ω2=1.2-1.5 to form uniform grid-like grinding lines. At the same time, select diamond grinding fluid with a concentration of 5-15% and configure the flow rate at 1.5-2L/min per 100mm disc diameter to optimize the grinding environment.
In summary, by targeting the three core bottlenecks of abrasive grinding force, workpiece deformation and pressure control, combined with equipment precision upgrades and process parameter optimization, the
Ceramic Double-Sided Lapping Machine can stably achieve high-precision processing goals, effectively meet the growing technical needs in the field of precision ceramic processing, and provide strong support for the high-quality development of the industry.
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