In semiconductor manufacturing, CMP technology can be used to remove impurities such as oxide layers, silicides, and metal residues on the wafer surface to ensure the performance and stability of devices like crystals. CMP technology is a very important technology in modern semiconductor manufacturing.

During the CMP process, a special liquid abrasive, namely CMP slurry, is required.

Common types of CMP slurry include tungsten CMP slurry, dielectric CMP slurry, copper CMP slurry, aluminum CMP slurry, silicon wafer CMP slurry, silicon carbide wafer CMP slurry, and hard disk head CMP slurry.

CMP slurry is a mixture of various chemical substances, which mainly includes abrasives, buffers, polishing agents, and additives.

Among them, abrasives mainly play a role in removing oxides and metal residues on the silicon wafer surface; buffers mainly function to adjust the pH value and maintain the stability of the liquid; polishing agents mainly serve to lubricate and reduce surface friction; and additives mainly improve the dispersion and chemical reaction performance of the CMP slurry.