Compared with traditional coating processes, modern Wafer Coatering Machine has technical advantages such as nanometer-level thickness control, dense and defect-free film layers, and eco-friendly pollution-free operation. It can significantly improve the wear resistance, corrosion resistance, light transmittance, electrical conductivity and other properties of base materials. At present, the equipment has been fully applied in semiconductors, new energy, optical instruments, precision machinery and other fields. It is a key supporting device for surface modification of high-end materials and performance iteration of devices, as well as one of the important equipment indicators for measuring the level of precision manufacturing.