Functional ceramics such as alumina, aluminum nitride and silicon carbide have become core substrate materials for semiconductor packaging substrates, new energy power devices and optoelectronic sensors due to their high thermal conductivity, superior insulation, high temperature resistance and low thermal expansion. Ceramic materials feature high hardness and great brittleness. Traditional grinding and polishing processes can only achieve micron-level flattening, leaving micro scratches, residual stress and microscopic unevenness on the processed surface, which fail to meet the mirror defect-free substrate standards required for high-end chip packaging. Therefore, the Ceramic CMP Polisher has become the core equipment for ultra-precision finishing of ceramics.