With the rapid iteration of semiconductor chips toward miniaturization, light weight and high integration, wafer thickness has been reduced to the hundred-micron or even ten-micron level. Ultra-thin substrates are highly susceptible to warpage, deformation, microcracks and other defects caused by mechanical stress. Traditional contact thinning equipment driven by mechanical bearings and guide rails suffers from frictional vibration and uneven contact pressure, resulting in large residual stress and poor thickness consistency on processed wafers, which fail to meet the process requirements of high-end power semiconductors and advanced packaging. Therefore, the
Air-Spindle Grinding Machine has become the core equipment for precision thinning of ultra-thin wafers.
Adopting core aerostatic spindle and non-contact air-float guide rail technologies, the equipment operates supported by a uniform high-pressure air film, completely eliminating the traditional mechanical contact and friction structure. It features zero vibration, zero wear and zero mechanical stress interference during operation. The ultra-stable motion reference fundamentally avoids processing defects such as wafer edge chipping, surface damage and lattice distortion, making it especially suitable for precision thinning of large-size and ultra-thin silicon wafers and silicon carbide wafers.
Equipped with a high-precision closed-loop detection and intelligent constant-pressure control system, the whole machine monitors wafer thickness changes in real time and dynamically adjusts the grinding speed and material removal volume, realizing micro-volume, layer-by-layer and uniform material removal. It effectively corrects the overall thickness deviation of wafers and optimizes the parallelism and flatness of the entire wafer. The processed wafers feature uniform and flat surfaces with an extremely thin subsurface damage layer, providing a high-quality substrate foundation for subsequent precision processes such as polishing, bonding and coating.
Compared with traditional thinning equipment, the Air-Spindle Grinding Machine has remarkable advantages of high precision stability, long service life and high process repeatability. It maintains stable precision during long-term mass production and greatly improves the yield of wafer processing. Compatible with precision thinning of various specifications of semiconductor wafers, the equipment adapts to both R&D sample trial production and automated mass production scenarios. With the core performances of zero stress, ultra stability and high precision, it continuously promotes the upgrading of high-end precision semiconductor manufacturing processes.
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