Aluminum nitride ceramics feature high thermal conductivity, superior insulation performance and a low thermal expansion coefficient, serving as the core heat dissipation substrate material for semiconductor power devices, 5G radio frequency modules and new energy IGBT modules. However, the material is hard and brittle with poor impact resistance. The traditional single-side lapping process causes uneven stress, which easily leads to substrate warpage, edge chipping, surface microcracks and excessive thickness deviation, failing to meet the micron-level parallelism and damage-free machining standards for high-end electronic substrates. The
Aluminum Nitride (AlN) Double-Side Lapping Machine has therefore become the dedicated core equipment for the precision finishing of aluminum nitride ceramic substrates.
Exclusively optimized for brittle aluminum nitride ceramic materials, the machine adopts a precision planetary double-side synchronous lapping structure. The upper and lower lapping discs operate synchronously at a constant speed, enabling uniform pressure and grinding on both sides of workpieces and fundamentally eliminating mechanical stress and deformation caused by single-sided extrusion. Different from the large-margin cutting mode of ordinary metal lapping equipment, this machine adopts a controllable micro-removal process, which can precisely remove sintering-induced uneven layers, surface burrs and processing textures on substrates, effectively avoiding process defects such as brittle fracture, delamination and micro-damage.
Equipped with a high-rigidity shock-absorbing body and a closed-loop pressure regulation system, the machine achieves extremely low disc runout during operation. It can adaptively adjust the rotating speed, lapping pressure and processing duration according to the thickness and hardness specifications of aluminum nitride substrates. Matched with special ceramic lapping consumables and a purification filtration system, it prevents particle impurities from scratching the substrate surface. After processing, the substrates deliver stable flatness and parallelism accuracy, with ultra-small thickness deviation between pieces and a uniform and delicate surface texture.
The machine can complete multiple processes including double-side flattening, precision dimension trimming and surface homogenization in one go, with much higher processing efficiency than traditional single-side equipment, suitable for small-batch sample production and automated mass production. The processed aluminum nitride substrates are free of residual stress and feature high precision consistency, which effectively improves the heat dissipation efficiency and operational stability of devices. Widely applied in the optoelectronic, semiconductor and new energy precision ceramic industries, it is an essential device for the precision machining of high-end aluminum nitride substrates.
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