Adapting to Advanced Packaging Requirements: In chip stacking (e.g., 3D IC, SiP packaging), thinned wafers (with a thickness of 50-100μm) can significantly reduce the stacking height, enabling device miniaturization (such as mobile phone SoC chips and wearable device chips). Meanwhile, thinner wafers facilitate the implementation of Through-Silicon Via (TSV) technology, improving signal transmission speed between chips.

Enhancing Heat Dissipation Efficiency: Heat generated by chips during operation must be conducted through wafers to the heat dissipation structure. Thicker wafers (e.g., >300μm) form a "thermal resistance barrier". After thinning (e.g., <100μm), thermal resistance can be reduced by 40%-60%, preventing performance degradation or shortened lifespan caused by overheating (typical applications: power semiconductor chips, automotive electronic chips).

Meeting Performance Requirements of Special Devices: MEMS (Micro-Electro-Mechanical Systems) devices (e.g., accelerometers, gyroscopes) require wafer thinning machines to achieve "mechanical sensitivity" by reducing wafer thickness to 20-50μm—thinner wafers are more prone to slight deformation under external forces, thereby accurately sensing physical signals.
Additionally, thinning RF (Radio Frequency) chips can reduce electromagnetic interference and improve signal stability.