Market Application and Current Status of Dual-spindle Wafer Grinder-

Market Application and Current Status of Dual-spindle Wafer Grinder

2025-12-11829

Industry Positioning and Core Requirements

The Dual-spindle Wafer Grinder is a key piece of equipment in the backend packaging of semiconductor manufacturing. It achieves rough and fine grinding of wafers through dual-axis synchronous lapping. It rapidly reduces wafer thickness while improving surface roughness. Its processing accuracy directly affects the heat dissipation performance, packaging density and reliability of chips.

With the trend toward thinner, lighter and higher-density semiconductor devices, the market has imposed stringent requirements: flatness ≤2μm, total thickness variation (TTV) ≤3μm. The equipment must be compatible with wafers of different specifications ranging from 6 to 12 inches, as well as new hard and brittle materials such as silicon carbide and gallium nitride.
Current Core Technical Challenges
1. High-Precision Control ChallengesIn the processing of ultra-thin wafers (<50μm), stress-induced warping is prone to occur, and warp fluctuations often exceed threshold values. Hard and brittle materials have high hardness and brittleness, making lapping prone to microcracks and edge chipping. It is difficult to balance processing efficiency and surface quality simultaneously.
2. Bottlenecks in Equipment Stability and ReliabilityLong-term operation of grinding wheels tends to cause profile distortion. Insufficient accuracy of real-time compensation algorithms affects processing consistency. Traditional vacuum or mechanical clamping methods are likely to cause deformation and damage of ultra-thin wafers, restricting the improvement of processing accuracy. Environmental factors such as temperature fluctuations and vibrations significantly interfere with dual-axis coordination accuracy. Stable processing technology under extreme environments awaits breakthroughs.
Key Breakthrough Paths
1. Innovation in High-Precision Control TechnologyAdopt a servo motor + grating ruler closed-loop feedback system to achieve ±0.1% synchronization accuracy of dual-axis rotation speed and pressure. Combine with adaptive algorithms to stably control flatness within 2μm. Integrate a laser interferometry thickness measurement module, dynamically correct the grinding amount through PID algorithms, and reduce TTV deviation to ≤1μm.Develop a three-stage process of "rough grinding - fine grinding - polishing" for hard and brittle materials. Match with ultra-fine diamond grinding wheels and elastic lapping pads to reduce defect rates.
2. Equipment Structure and Function UpgradingEquip with an on-line surface profile detection system to monitor grinding wheel wear in real time, automatically dress the wheel and adjust its angle to ensure long-term stability. Adopt air-float clamping or electrostatic adsorption technology to evenly distribute clamping force and avoid damage to ultra-thin wafers. Built-in constant temperature and humidity system and vibration damping platform control temperature fluctuations within ±0.5℃ and vibration amplitude within 2μm, reducing environmental interference.
3. Breakthroughs in Core Components and AlgorithmsPromote the localization of core components such as air-float spindle units and precision ball screws to consolidate the foundation of mechanical accuracy. Introduce machine learning algorithms to optimize the combination of process parameters based on massive data. Realize adaptive processing of wafers of different specifications and materials, and improve accuracy consistency.

The technological breakthrough ofDual-spindle Wafer Grindermust take high-precision control as the core, equipment structure upgrading as the support, and core component and algorithm innovation as the driving force. Multi-party collaboration is needed to solve the problems of accuracy, stability and material compatibility, providing key equipment guarantee for the development of the semiconductor industry toward thinner, lighter and higher-density directions.
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