In the mass production of mid-to-low-end semiconductor chips, power devices and MEMS sensors, 6-inch silicon wafers are one of the most widely used substrate materials. As the core equipment of wafer processing, the vacuum Wafer Coating Machine is the key to endowing 6-inch silicon wafers with electrical properties, protection capability and processing accuracy. The matching process between them is the core link to ensure stable chip operation. The Wafer Coating Machine mainly adopts two mainstream technologies PVD and CVD for wafer coating. The whole process is conducted in a high-vacuum environment, avoiding oxidation and surface contamination of silicon wafers by airborne impurities and ensuring high film purity. Given the standard size and mass-production compatibility of 6-inch silicon wafers, the equipment converts metal and dielectric materials into atomic particles via electron beam evaporation, magnetron sputtering and other methods, which deposit uniformly on the wafer surface to form nano-scale precision thin films. Coating technology is critical to 6-inch silicon wafer manufacturing. Before coating, 6-inch wafers undergo precision grinding and polishing to remove surface scratches and flatness errors, laying a solid foundation for film deposition. The Wafer Coating Machine can deposit metal conductive films, insulating passivation films and wear-resistant protective films on wafer surfaces. It not only constructs circuit conduction structures for chips, but also isolates moisture, dust and static electricity, improving device stability and service life. Compared with large-size wafers, 6-inch silicon wafers feature mature processes and cost controllability. The Wafer Coating Machine precisely controls film thickness, uniformity and adhesion, suitable for mass production of power diodes, transistors, MEMS sensors and other components. It can be stated that the precision deposition technology of Wafer Coating Machine transforms ordinary silicon wafers into functional core semiconductor substrates, serving as indispensable core process equipment in the 6-inch semiconductor industrial chain.