How to Improve the Processing Accuracy of Semiconductor Materials on the Copper Plate Polishing Machine-

How to Improve the Processing Accuracy of Semiconductor Materials on the Copper Plate Polishing Machine

2026-02-12882

In semiconductor manufacturing, the surface accuracy of materials directly determines device performance. As core processing equipment, the accuracy improvement of the Copper Plate Polishing Machine can be carried out from two key aspects: equipment hardware and precision calibration, and stepped optimization of process parameters, balancing accuracy and processing efficiency to support the high-quality development of the semiconductor industry.

Equipment Hardware and Precision Calibration: Consolidate the Foundation of Accuracy
The stability of equipment hardware and calibration accuracy are prerequisites for processing accuracy.
In terms of hardware: a PLC + touch screen control system is adopted to ensure convenient parameter operation and system stability; variable frequency speed regulation of the main motor realizes soft start and stop, reducing equipment impact and workpiece damage; cylinder pressurization with closed-loop control of an electrical proportional valve ensures accurate and stable copper polishing pressure, and active driving of the upper platen guarantees consistent processing at each station.
In terms of calibration: the polishing platen and upper platen are equipped with a cooling function to reduce surface deformation. The built-in platen dresser can control the flatness of the platen within 0.01 mm, guaranteeing high-precision copper polishing.
Stepped Optimization of Process Parameters: Precisely Improve Accuracy
Balanced accuracy and efficiency are achieved through stepped optimization of process parameters.

Rough polishing stage: high polishing platen speed and copper polishing pressure are used to quickly remove material allowance, with strict control over equipment vibration and workpiece clamping stability.
Fine polishing stage: reduce rotation speed and pressure, cooperate with high-precision platen calibration, and optimize cooling parameters to reduce thermal deformation.
Final polishing stage: perform fine machining at extremely low speed and pressure, combined with real-time calibration by the dresser, to finally achieve stable and high-precision copper polishing.

In summary, through precise calibration of equipment hardware and stepped optimization of process parameters, the Copper Plate Polishing Machine can effectively improve the processing accuracy of semiconductor materials and help the industry break through accuracy bottlenecks.

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