Grinding and Polishing Machine eliminates surface defects such as scratches and burrs through the relative motion between grinding media and workpieces, achieving a flat, smooth, or even mirror-like finish. Widely used in the optics, aviation, automotive, mold, gemstone, and well-known hardware industries, it is a key equipment for improving product surface quality.
Based on the "mechanical friction + grinding media" dual mechanism, the core links are as follows:
- Motion System Drive: Rotational drive is the main type. A motor drives the grinding disc (rotational speed: 0-80 r/min) to rotate, and workpieces are fixed by fixtures. High-configured machines are also equipped with a main drive system to ensure consistent workpiece grinding.
- Pressure Regulation Technology: The pressure range is 0-150 KG, which can be automatically adjusted via pneumatic or weight systems. The pressure is determined by workpiece material, processing precision requirements, and processing technology. High-end equipment is equipped with pressure sensors to maintain stable pressure.
- Adaptation of Grinding Discs and Grinding Fluids: The selection of materials for grinding discs and grinding fluids, the size of particle sizes, and the formulation of formulas all need to be adjusted according to the detailed requirements and parameters of the product. Only when the two are matched can the optimal grinding effect be achieved.
- Metal Processing: For stainless steel, use metal/resin-bonded grinding discs + special polishing agents (grinding pressure: 10-30 KG, rotational speed: 20-40 r/min; polishing pressure: 20 KG, rotational speed: 5-20 r/min); for aluminum alloys, use alumina abrasives + polyurethane polishing pads (pressure: 15-30 KG, rotational speed: 15-35 r/min).
- Semiconductor Materials: Use resin-bonded grinding discs + diamond grinding fluids (grinding pressure: 2-20 KG, rotational speed: 20-40 r/min; polishing pressure: 20-30 KG, rotational speed: 5-20 r/min); use alumina/silicon dioxide + polyurethane polishing pads (pressure: 5-20 KG, rotational speed: 5-25 r/min).
In summary, relying on core technical principles such as rotational drive, precise pressure regulation, and adaptation of grinding/polishing media, combined with customized application solutions for metal, semiconductor, and other fields,
Grinding and Polishing Machine has become a key equipment for improving product surface quality in industries such as optics, aviation, and automotive, providing strong support for the refinement and high-quality development of industrial production.
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