1. Principles and Advantages of Wafer Edge Grinding Machines

• Precision parameter input mechanism: Supports digital input of key parameters such as wafer diameter (Φ4-8 inches), positioning edge length, and surface width, with parameter setting precision up to 0.001mm. The system can automatically match the corresponding processing algorithm, avoiding errors caused by manual parameter adjustment and ensuring that process parameters are highly consistent with processing requirements.

2. Technical Parameters of Wafer Edge Grinding Machines

• Motion and measurement precision: The minimum motion resolution of the grinding wheel is only 0.5μm, enabling nanoscale feed control;
• Positioning and platform precision: 3 sets of CCD visual positioning systems work together, with a positioning pixel precision of 3μm and a repeat positioning precision of 5μm for each axis, ensuring that the position deviation of each wafer clamping is less than the process threshold; the grinding platform adopts a marble base, with end face runout controlled within 5μm, and the concentricity between the product and the grinding table is ±5μm, eliminating the impact of platform vibration on processing precision;
• Grinding and shape precision: When the grinding wheel angle is 45°, the chamfering precision is stably controlled within 10μm; the wafer roundness control capability is <10μm, and the angle control precision is ±0.1°, which can meet the strict requirements for edge shape precision of semiconductor chips, optical lenses, etc.

3. Industrial Applications of Wafer Edge Grinding Machines

• Semiconductor field: When performing double-sided chamfering on silicon wafers and silicon carbide wafers, it can avoid edge cracking, while ensuring wafer flatness, providing qualified substrates for subsequent lithography and packaging processes, and reducing the defect rate in chip manufacturing;
• Optical field: For materials such as optical glass and sapphire crystals, it can precisely control the chamfer angle and edge finish, reduce light refraction loss, and improve the light transmittance and imaging quality of optical components.

From the above, it can be concluded that the Wafer Edge Grinding Machinesachieves micron-level processing precision through high-precision grinding, visual positioning and digital parameter control. It can meet the chamfering needs of hard and brittle material wafers in the semiconductor and optical fields, provide qualified substrates for subsequent processes and reduce the defect rate.