Semiconductor Wafer Thinning Equipment: Core Positioning, Classification and Practical Control Points-

Semiconductor Wafer Thinning Equipment: Core Positioning, Classification and Practical Control Points

2026-02-17945

Semiconductor Wafer Thinning Equipment is core equipment for semiconductor back-end packaging. Its core function is to precisely thin wafers from an initial thickness of 600–800 μm to a target thickness of 50–200 μm through precision grinding and lapping processes, meeting advanced requirements such as chip thinning and 3D packaging. Its accuracy and stability directly determine packaging yield, and it is widely used in the processing of silicon, gallium arsenide, silicon carbide and other wafers.

Core Equipment Classification
According to processing methods, it is divided into two categories:

Mechanical thinning equipment, centered on grinding wheel grinding, including back-thinning machines and wafer grinders, focusing on mass production, which is the mainstream in the industry.
Laser thinning equipment, featuring non-contact processing, suitable for ultra-thin and hard-brittle wafers ≤ 50 μm, with low defect rate, but relatively high efficiency and equipment cost.

Core Components and Requirements
Core components must be precisely calibrated: spindle radial runout ≤ 0.5 μm, feeding mechanism positioning accuracy ≤ 0.1 μm, equipped with on-line detection and cooling system (flow rate 10–15 L/min). Consumables are matched by stages: rough grinding uses 500–2000# diamond grinding wheels, fine grinding switches to 3000–8000# resin-bonded grinding wheels. Cross-contamination of grinding debris is strictly prohibited.
Process and Quality Control
Staged grinding is adopted: rough grinding (1500–2500 rpm, 0.3–0.5 MPa) for high-efficiency material removal, fine grinding (3000–4000 rpm, 0.1–0.2 MPa) to ensure accuracy, ensuring thickness deviation ±1–2 μm and TTV ≤ 2 μm. Full-process control: Class 100 cleanliness, temperature ≤ 40 ℃. Dual inspection is used to check defects such as edge chipping and thickness deviation to meet packaging requirements.

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