Ceramic CMP Polisher is a core equipment for ultra-precision machining. By virtue of the synergistic effect of chemical corrosion and mechanical grinding, it achieves atomic-level planarization of ceramic material surfaces, playing an irreplaceable role in the production of high-end ceramic products.

The equipment can precisely process a variety of high-performance ceramic materials, including oxide ceramics such as alumina (Al₂O₃) and zirconia (ZrO₂), as well as non-oxide ceramics such as silicon nitride (Si₃N₄) and aluminum nitride (AlN). The processing process follows the principle of precision synergy: polishing fluids adapted to material characteristics (such as diamond suspension and colloidal silica polishing fluid) exert chemical corrosion to weaken the atomic bonding force on the material surface; at the same time, high-precision grinding discs are used for mechanical grinding to remove the surface corrosion layer and defect layer. Through closed-loop control of grinding pressure (0.1-0.5MPa), polishing disc speed (30-100r/min) and polishing fluid flow rate (1-5L/min), the equipment ensures that the surface roughness of the processed material is ≤0.01μm and the flatness is ≤0.3μm, meeting the requirements of precision applications.

Its industrial applications widely cover electronic information, semiconductors, new energy, aerospace and other fields. In the electronic information industry, it is used for polishing 5G filter ceramic media and mobile phone ceramic backplanes to ensure signal transmission efficiency and structural stability. In the semiconductor field, it adapts to the ultra-precision processing of ceramic packaging substrates and wafer carriers, improving chip heat dissipation performance and packaging accuracy. In the new energy industry, it is applied to the polishing of ceramic insulated gate sheets and battery ceramic separators to enhance the high-voltage and high-temperature resistance of devices. In the aerospace field, it is used for processing ceramic seals of aerospace engines and ceramic components of sensors to ensure service reliability in extreme environments.

Its core role is reflected in: eliminating defects such as microcracks and pores on the surface of ceramic materials through ultra-precision polishing technology, improving material mechanical strength and surface quality; at the same time, ensuring the dimensional accuracy and assembly compatibility of ceramic components, providing key processing support for the performance upgrading of high-end products in downstream industries, and promoting the in-depth application of ceramic materials in the field of precision manufacturing.